• Available specifications:

Base materials: FR4, aluminum, FPC and copper
Copper thickness: 0.5oz (minimum)
Copper thickness: 4oz (minimum)
Board thickness: 0.2mm (minimum)
Board thickness: 3.2mm (maximum)
Surface finishing: HAL, ENIG, OSP, gold finger and tin chemistry
Possible soldermask colors: green, black, white, yellow, blue, red and more
Board dimensions: 600 x 1,000mm
Hole diameter: 0.2mm (minimum)
Line width: 0.075mm (minimum)
Line spacing: 0.075mm (minimum)
SMT pitch: 30° (minimum)
Annular ring: 0.05mm (minimum)
Aspect ratio: 11:01

• Surface/hole plating tolerance:

Hole tolerance (PTH): 0.25mm
Hole tolerance (NPTH): 0.15mm
SM tolerance (LPI): dimension

• Electrically test: supported
• Compliant with RoHS Directive
• Possibility of SMT device mounting: supported