3D measurement of semiconductor chip solder BGA X-ray machine

3D measurement of semiconductor chip solder BGA X-ray machine
Model:HT-100
Brand:HAOAO
Origin:-
Category:Industrial Supplies / Electrical & Electronic Product Equipment
Label:xray , Detection of X-ray m , X-ray machine
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Product Description

The HT series X-ray inspection equipment of HAOAO"s  product is used to detect welding defects of BGA, CSP, flip chip, semiconductor and other electronic components.It is a high-resolution X-ray equipment. Itis used for the development of the SMT process and production process monitoring and rework stations
It uses the international manufacturing standards. It has excellent detection performance and
excellent value for money.It is a high-return investment.It is small and easy to move.It uses ergonomic design.It has a large detection range.It has.high-resolution dual mode detector.
It has Plane detector (option) and high magnification and versatile image analysis software

It has a simple operator interface
It uses the Windows XP operating system. It's easy to maintain and it is also simple to install
3D measurement of semiconductor chip solder BGA X-ray machine 1

Member Information

HAOAO Technology Co.,LTD
Country/Region:Guang Dong - China
Business Nature:Manufacturer
Phone:15019253447
Contact:william (manager)
Last Online:14 May, 2018