Copper Cored Solder Ball forms bumps between a substrate and a chip and the core of the bumps keeps
fixed height as designed and relieves an external impact as well.Copper Cored Solder Ball is an excellent
solution for the 3D stack package, and also has a certain application in the narrow-pitch packaging field.

CSB(Cored Solder Ball) forms bumps between a substrate and a chip and the core of the bumps keeps fixed height as designed and relieves an external impact as well.

Cored Solder Ball can be applied to highly reliable solder joint instead of normal solder ball.

Solder Plating: SAC305, Sn