Auto-place & pick BGA Rework Station KID-R600 with high resolution optical alignment system (white color)

Auto profile, W-kidi patent technology

High-resolution Optics Alignment System to realize perfect imaging on LCD monitor

• Hot air head and mounting head integration design, step motor drive, with auto soldering and desoldering functions.
• New-style hot air and IR mixed 2 in 1 for upper head heating; temperature rises fast,   which leads to the big temperature difference between BGA and others around with no effects on them; suitable for PCB with small pitch between components.
• Three separate heating areas, upper/lower hot air and bottom IR; heating time and temperature can display on the touch screen.
• Large movable bottom pre-heating area, PCB clamping device can be flexibly adjusted on X/Y-axis; applicable to Max. PCB size 550*500mm.
• Powerful cross flow fan cools down the lower heating areas quickly.
• Color high-resolution optical vision system with split vision, zoom in and fine-adjusting functions, aberration distinguish device included, auto-focus, software operation, 22x optical zoom, applicable to BGA size range 1 * 1 mm ~70*70mm.
• Embedded industrial computer, touch screen interface, PLC control with real-time temperature profile display; both setting profile and real temperature profile can be displayed；
•  Inbuilt vacuum pump, rotatable 60° in Φ angle, fine-adjusting mounting suction nozzle.
• Upper/lower heater with 8 segments of temperature up (down) and 8 segments of constant temperature control, industrial computer can save temperature profiles without limit; can analysis profiles on the touch screen. 
• Suction nozzle can detect mounting height automatically with pressure controllable within 10gram.
• Many sizes of alloy nozzle, easy for replacement; can locate at all angle.
• Color optical vision system automatically moves through motor
• Equipped with thermocouple port, real-time temperature monitoring and analyzing functions.
• Auto-pick and place BGA chips on jigs with locating scales; after inputting the BGA size on touch screen, upper head can automatically come to the center of the BGA and pick it up, better for volume production.
• With solid state running status display, to make temperature control safer and more reliable;
• Under different environment or in different areas, auto-generate standard SMT desoldering profiles; no need to set profiles and users with repair experience or not can operate it easily;

• Model No : KID-R600
• Max PCB size: L550*W500mm
• PCB thickness: 0.5~2.5mm
• Applicable BGA: 1*1~70*70mm
• Min. ball pitch: 0.15mm
• Max. weight of BGA: 150g
• Placement accuracy: ±0.01mm
• PCB locating way: Outer
• Working table adjustable: forward/backward ±10mm, left/right ±10mm
• Temperature control way: K-type thermocouple, close loop control
•  Lower hot heater: hot air 800W
• Upper hot heater: hot air 1200W
• Bottom pre-heating: IR 3600W
• Power: Single-phase 220V、50/60Hz
• Machine size: L850*W750*H630mm
• Machine weight: approx. 80KGS

• Standard nozzles: 5pcs
• Lower big nozzle: 1pc; small nozzle: 1pc
• Allen wrench: 1set
• User manual: 1pc
• Brush: 1pc
• Suction nozzle: 5 pcs
• Thermocouple: 1pcs
• Mouse: 1pcs
• Aluminum plate: 1pcs