Product Description
Product Features Product Features
★ high thermal conductivity ceramic substrate, the heat generated by the chip can be rapidly conducted through the ceramic substrate outwardly
High conductivity of the ceramic substrate, the heat generated by the chip can be quickly elongated plate.
★ High reliability, rated current, 5000 hours attenuation less than 3%
High reliability, attenuated, 3000 hours is less than 5% of the rated current.
★ luminous uniformity, soft light, no glare, no light spot
Uniform soft light radiation, no glare, no light spot.
★ high color rendering index, high luminous efficiency
High CRI (color rendering index) and high luminous efficiency.
★ easy assembly, free and combined, without PCB, direct contact with the heat sink
Easy to assemble, can be combined, does not require direct contact with the PCB, the heat sink
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