8 layer PCB with buried via manufactured
Product Description
Base Material:FR-4
Copper Thickness:1/1 OZ
Board Thickness:1.6mm
Min.Hole Size:0.2mm
Min.Line Width:0.2mm
Min.Line Spacing:0.2mm
Surface Finishing:Immersion Gold
Solder mask:Green
Routing:CNC
Packaging:Vacuum Plastic
Specification:
L2-L7 buried via,drill hole size: 0.2mm
L1-L2/L7-L8 blind via,laser drilling hole size:0.15mm
BGA hole size: 9mil, pl ed vias
One-Stop Service:PCB-Components Purchasing-SMT-PCBA-Delivery.
All the PCBs are produced and inspected under IPC Standards.
Payment Terms: | T/T OR WESTERN UNION OR PAYPAL OR OTHERS |
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