Multilayers PCB Board 20-Layers Circuit Board
Product Description
Technical data:
Surface coating: Gold platting, H. A. L, immersion tin, immersion gold, OSP, lead free HAL, immersion silver.
Used material: FR4, CEM3, CEM1
Max layer: 30 layers
Maximum board size: 20inch*24inch 500mm*600mm
Minimum board thickness(outer):
12mil 0.30mm 2L
24mil 0.60mm 4L
48mil 1.20mm 6L
64mil 1.60mm 8L
Minimum board thickness(inner): 12mil 0.30mm
Maximum aspect ratio: 8: 1 8: 1
Minimum SMD spacing: 4mil 0.1mm
Minimum finished hole size: 8mil 0.2mm
Layer count: 2-8L
Minimum trace space/width: 4mil 0.1mm
Maximum copper weight: 3OZ
Control impendence: 10%
Blind/buried via: Y
Relative compliance: ISO9001: 2000, ISO/TS16949: 2002, ISO14001: 2004, UL.
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