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F650 is a PCB high precision stencil printer /auto solder paste printer, which is designed for high precision steel mesh or stencil printing in SMT industry.
Product Features：
Wide compatibility for PCB dimensions from 50mm x 70mm to 700mm x 500mm and PCB thickness from 0.8mm to 6mm
High printing resolution
High positional accuracy, repeated positioning accuracy ±0.01mm; printing accuracy 0.025mm.
Support glue printing
Automatic control improves production efficiency, quality control and saves production cost:
Automatic steel mesh positioning;
Automatic PCB alignment;
Automatic adjustment of squeegee pressure;
Automatic printing;
Automatic stencil cleaning (dry-type, wet-type and vacuum-type);
Adopt company independently developed suspended print head and programmable automatic pressure adjustment system with pressure closed-loop feedback. Support on-line real time pressure feedback and automatic squeegee pressure balancing. Accurate pressure control ensures perfect forming effect of solder paste.
Programmable motor controls the squeegee demold speed and stroke from steel mesh, to realize multi-method demold.
Multi-functional PCB fixed positioning system, convenient and accurate PCB positioning.
Upward and downward visual positioning.
Built-in image processing system
Support 2D,SPC functions 
Applicable Component Types
SMT Components such as resistors, capacitors, inductors, diode and triode: 0201, 0402, 0603, 0805, 1206 and other specifications;
IC: support SOP, TSOP, TSSOP, QFN packaging, min. pitch 0.3 mm; support BGA, CSP packaging, min. ball diameter of 0.2 mm;
Printing size：100mm x 80mm ~850 mm x 500 mm;
PCB Thickness：0.8 mm ~ 6 mm
Thickness：thickness≦ 0.8 mm (excluding jig)
PCB Application
Applicable to production and manufacturing of mobile phone, communication, LCD TV, STB, family cinema, vehicle electronics, medical power equipment, aerospace and aviation, besides general electronics products.