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* Three independent heating zones, suit for the non-lead system process.

* Upside heating zone and the base heating zone use finely heating material to produces the high temperature breeze. The welding effect surpasses the BGA rework, bottom only have infrared to send hot board machine.

* The third heating zone use infrared heating to prevent PCB board trans-shape.

* Six-section temperature controls, simulates re-flower effect completely.

* Big well distributed air cools PCB after heating, to prevent PCB deflection.

* BGA welding on completion of the demolition, a voice prompt

* Vacuum wand sucks BGA, convenient, reliable and durable

* Card board with a special tooling for a wide variety of notebook motherboard

* PLC, PC interface control.

* COM connection, connect with computer to achieve hi-end rework function.

* Rich software features: Simple and friendly interface, set up, modify, save the parameter, the parameter groups does not limit their number; The temperature curve test, analyze, print, the saved; Automatically track the heating process, automatic drawing of the heating process curves; Temperature setting, temperature deviation correction; Password locking mechanism, conditions permitting mechanisms, etc.

* Machine vision system using CCD, BGA ball in melting return procedure. (this feature is optional)