8 layer rigid flex pcb for telcom equipment
Product Description
| Layer NO# |
8 |
Min Line Width:/mm |
0.10 |
| Unit Size:/mm |
124.00 |
110.00 |
Min Line Space:/mm |
0.10 |
| Panel Size:/mm |
124.00 |
110.00 |
Min Hole: |
0.25 |
| Units in Panel |
1 |
Hole QTY/sq.m: |
35K |
| X-out allowed |
0 |
Solder Mask: |
Black x2 |
| Material: |
FR4(8L)+Flex(2L) |
Silk Screen: |
White x2 |
| Finished Thickness:/mm |
0.6 |
Burried/Blind hole: |
na |
| Outer Copper:/um |
35/35um |
Impedance Control: |
yes |
| Inner Copper:/um |
35/35um |
Profiling: |
routing |
| Surface Treatment: |
ENIG |
Test Way: |
test fixture |
Product Image
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