Product Description
LED mining lamp imported high-power LED chip packaging technology eutectic solder, eutectic solder material of heat transfer coefficient of 60W / MK, is 20 times that of traditional silver-crystal process heat transfer coefficient (traditional silver thermal conductivity of solid crystal craft coefficient of only 3w / mk), instant heat generated by the LED heat conduction to the substrate, LED will not heat accumulation, eutectic technology reduces the thermal resistance of the LED faster heat dissipation, the LED attenuation smaller, extend the LED's lifetime.
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