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Thermal Conductive Soft Gap Filler Pad For CPU 1Thermal Conductive Soft Gap Filler Pad For CPU 2Thermal Conductive Soft Gap Filler Pad For CPU 3Thermal Conductive Soft Gap Filler Pad For CPU 4
  • Thermal Conductive Soft Gap Filler Pad For CPU 1
  • Thermal Conductive Soft Gap Filler Pad For CPU 2
  • Thermal Conductive Soft Gap Filler Pad For CPU 3
  • Thermal Conductive Soft Gap Filler Pad For CPU 4

Thermal Conductive Soft Gap Filler Pad For CPU

Model:PM300
Brand:Karefonte
Origin:Made In China
Category:Electronics & Electricity / Insulation Material
Label:Gap Filler Pad , Soft Gap Pad , CPU Thermal Pad
Price: US $0.03 / pc
Min. Order:100 pc
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Member Information

Detail

Product Description

PM300 thermal pad combine high thermal conductivity with compliance perfect, can fill the gaps, improve heating parts and the radiating part of the heat transfer capacity. These soft interface material can make the minimum pressure and the surface to combine , resulting in little or no stress on mating parts. Taking advantage of silicone soft  and elastic characteristics, placed between the power heating device and heat dissipating structure, the power module effectively transfer the heat to the radiating component. 


Applications: 
1.Car engine module, notebook computer 
2.Flat panel TV, mobile equipment, high-speed hard disk drive 
3.Between semiconductor and radiating fin 
4.Desktop, portable computer and server 
5.LED lighting device, the power supply of UPS 
6.LED and PDP flat panel display 


Performance: 
◆High thermal conductivity:3.2W/m-k 
◆Stable Performance, low thermal resistance, effectively improve the heat transfer speed 
◆Low hardness, its viscosity high, easy to use 


Specification: 
◆Standard size:310mm*310mm, 200mm*400mm according to customer needs cut the shape 
◆Basic thickness:0.25mm*5.0mm, special size and thickness can be customized 
Its slightly viscous, if need to strengthen the adhesive can be according to customer’s requirement 
◆Product color is mass production color, need special color can be adjusted according to the actual situation 


Price Terms:FOB/CIF
Payment Terms:TT / Western Union / Paypal / Monegram
Packing:box
Lead Time:After payment 1-3 working days
Standards Certificate:ISO 9001 , RoHS , REACH
Color:Blue / Grey
Size:200mm*400mm 310mm*310mm(customized)

Product Image

Thermal Conductive Soft Gap Filler Pad For CPU 1
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Thermal Conductive Soft Gap Filler Pad For CPU 2
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Thermal Conductive Soft Gap Filler Pad For CPU 3
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Thermal Conductive Soft Gap Filler Pad For CPU 4
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Send Inquiry to this Member

Shenzhen Jia Rifeng Tai Electronic Technology Co., Ltd.

4/F, Bldg.6, No168 Changshan Industrial Zone, Pingdi District, Shenzhen 518117, China.

Phone:
+86-755-29304991
Fax:
+86-755-22140591
Contact:
Zack (Sales Manager)
Mobile:
13632532281

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