Product Description
Is a suitable precision electronics lead-free interconnect application solutions, such as POP laminated chip connection, flip chip connection, ball or connection, BGA/CSP rework/repair.
But under air and nitrogen reflow, in Cu - OSP solder surface and excellent weldability of Au/Ni coating surface,
Bright spot, no residue. No clean.
In compliance with RoHS and halogen free.
Help the solder paste type
ROL0
Product Image
Send Inquiry to this Member
Related Products of this Company
This member assumes full responsibility for the content of this listing. DIYTrade accepts no responsibility whatsoever in respect of such content.
To report fraudulent or illegal content, please
click here.
China Suppliers Quick Searching:
,
