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The F solution   designed for test, debug, and validation of devices of BGA,  LGA, QFP, QFN, SOP, etc. For devices with more than 256 pins, please look for our “U” solution. 

Test, debug, validation of devices of BGA,LGA,QFP,QFN,SOP,etc

Pitch from 0.4mm to 1.27mm

"Buy and use" modular design

Standardized design shorten lead time

Feature:

F solution is designed for test, debug, and validation of devices of BGA, LGA, QFP, QFN, SOP, etc. 

The compact, surface mount design requires no tooling, no extra place or mounting holes in the target PC board, maximizing real estate while reducing board costs.

Precision machined spring probes with industry proven solder balls ensure high reliability performance, easy of maintenance and reduced testing downtime.

Fully removable double latch turning lid makes it can be used for both manual and automatic operation, and enable quick device insertion and extraction.

Avoid problem of pad co-planarity, oxidation and damage of PC board after de-soldering comparing to conventional design, Provide protection to PC board from cutting through by probes.

"Buy and use" modular design makes it no needs customer to provide PC board, protect customer's IP.

Standaridized design simplify processing,save cost and shorten lead time. 3 ~ 4 days since PO received to product delivery.

Specification:

Mechanical

Socket Body: Peek Ceramic

Socket Lid: AL,Cu,POM

Contact: Spring Probe

Solder Ball: RoHS Compliant(Lead-free)

                  96.5Sn/3.0Ag/0.5Cu(SAC305)     

Operation Temperature: -40ºC to 140ºC

Life Span at Operating Travel:100K cycles Min.

Cycles Spring Force: 20g ~ 30g per Pin

Electrical

Current Rating (Continuous) : 1A Min.

DC Resistance: 100mohm Max.