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Focused on meeting the unique needs of customers requiring advanced PCB assembly and testing. We have invested in leading technology and skills to ensure customers can access cost-effective solutions using the latest technologies.

Production services are flexible enough to handle low-to-high volume requirements or high and low-mix products with efficiency. From design through assembly and test, quality is a top priority. Assembly and inspection follows the IPC-A-610 requirements for either leaded or RoHS compliant production.

Capabilities Include: Complex double-sided, Ball Grid Array (BGA), Micro-BGA, flip-chip, fine-pitch, and high density component placement capabilitity (0201), in-circuit and functional testing. We are equipped with in-house x-ray inspection, and BGA rework tools. PCB assembly - surface mount assembly including 0402 and BEA MBEA placement and ball grid array (BGA) on multiple lines


Automatic optical inspection (AOI)
BGA Rework Stations
X-Ray Inspection
EMC and environmental testing
Pb-Free, RoHS Capable
Full Backup Power Coverage
Cable loom and cabinet wiring
Burn-in and environmental testing

Company Information
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Laptop Motherboard Test Function:
1. Check the appearance, such as turps, dust, tin soldering or other dirty mark on board.
2. Check whether lack of electronic insulation gummed paper.
3. Check whether lacks of fittings, rust, rot heat elimination chassis.
4. Check internal and external connector of LCD display , Two memory, DVD driver, Network connection, Voice, Mouse, Keyboard, Dial, USB, SD connector, PC, 3.3V COMS battery, Battery whether charge and discharge, Full running 3D, Restart system at least two times.