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Thermally Conductive Phase Change Material for chipset 1Thermally Conductive Phase Change Material for chipset 2Thermally Conductive Phase Change Material for chipset 3Thermally Conductive Phase Change Material for chipset 4Thermally Conductive Phase Change Material for chipset 5
  • Thermally Conductive Phase Change Material for chipset 1
  • Thermally Conductive Phase Change Material for chipset 2
  • Thermally Conductive Phase Change Material for chipset 3
  • Thermally Conductive Phase Change Material for chipset 4
  • Thermally Conductive Phase Change Material for chipset 5

Thermally Conductive Phase Change Material for chipset

Model:PC210A
Brand:JRFT
Origin:Made In China
Category:Electronics & Electricity / Insulation Material
Label:phase change silicon , thermal conductivity , chipset
Price: ¥0.3 / pc
Min. Order:1 pc
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Member Information

Detail

Product Description

Thermal Conductive Phase Change Silicone

1. Quick Details

Place of Origin: Guangdong, China(Mainland)      Brand Name: JRFT

Model Number: PC210A                             Material: Composite Polymer

Application: Phase Change Temp                                                     Color: grey

Thermal Conductivity: 2.5W/m-k                                                        Phase Change Temp: 50~60℃

2. Brief Introduction

     This material is heat reinforced polymer, to meet the thermal conductive of high terminal heat conduction application , reliability demand. Combined with the thermal resistance small channel so that the performance of the heat sink to achieve the best. Improve the micro processor, memory module DC - DC converter and the reliability of the power module.

The phase change characteristics : material is solid at room temperature and is convenient to install, used between the heat sink and device. When they reach the product phase change temperature materials become soft, flowing, filled into the device small irregular contact surface. So the phase change pad is better than that of non flow elastomer or graphite based thermal pad, and has the properties of thermal grease.

3. Advantages

(1). Flow but not silicone oil

(2). Low volatility -- less than 1%

(3). No need preheating the radiator

(4). Low thermal resistance under low pressure

(5). Inherent viscosity, easy to use and not need to use the adhesive

4. Applications

(1). DC--DC converter, memory module, power module, memory module, solid state relay, bridge rectifier

(2). High frequency microprocessor, chipset, graphics processing chips /power AMP chip, cache memory chip, customer homemade .

 

 


Product Image

Thermally Conductive Phase Change Material for chipset 1
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Thermally Conductive Phase Change Material for chipset 2
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Thermally Conductive Phase Change Material for chipset 3
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Thermally Conductive Phase Change Material for chipset 4
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Thermally Conductive Phase Change Material for chipset 5
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Send Inquiry to this Member

Shenzhen City Jia Rifeng Tai Electronic Technology Co., Ltd.

3/F, No.2 Bldg., Yinghe Industrial Park, Tongsheng Community, Dalang St., Longhua New District, Shenzhen, China

Phone:
86-755-29304991
Fax:
86-755-22140591
Contact:
Julie Chou (Foreign Trade Clerk)
Mobile:
18270828627

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