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AlN substrate is produced using AlN powder as raw material by tape casting and high temperature sintering processes. It has all the unique properties of AlN material and meets the requirements for electronic packaging baseplate, which makes it the key material in high density, high power and MCM semiconductor devices, HBLED and packaging.

Key properties

       1. High thermal conductivity, which is 5 to 10 times of Al2O3

       2. Thermal expansion coefficient matches with that of silicon

       3. Good mechanical property, which is close to Al2O3 and better than BeO

       4. Distinct electrical properties, with very high electrical resistivity and

        low dielectric loss

       5. Compatible with circuit materials, multilayer wiring could be used to

        achieve high density and miniaturization of packaging

       6. Non-toxic, environment friendly