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High Accuracy Die Bonding Micro Assembly Platform Sostar M5 1
  • High Accuracy Die Bonding Micro Assembly Platform Sostar M5 1

High Accuracy Die Bonding Micro Assembly Platform Sostar M5

Model:M5
Brand:SOSTAR
Origin:Made In China
Category:Electronics & Electricity / Other Electrical & Electronic
Label:die-bonding , vcsel pd lens , laser bar
Price: -
Min. Order:1 pc
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Detail

Product Description

M5 is a multifunctional micro assembly machine, better than 5μm 3σ alignment accuracy.

It can be integrated with Eutectic Die Bonding Module, Bonding Force Module,

Dispenser Module,UV Curing Module, Process Observing Module, Ultrasonic Bonding Module

to reach different customers’ requirement.

It is mainly used for assembly medical CT Detector, Fiber-optic communication VCSEL/PD/LENS,

LD Bar,RFID and  MEMS/MOEMS Sensor field etc

 

Placement Accuracy:±2.5μm 3σ

Working Area:X: 340mm;  Y:150mm; Z:20mm

Bonding Force:0.1N~200N

Heating Temperature:25℃~400℃

Component Size: 0.1mm~40mm

 


Product Image

High Accuracy Die Bonding Micro Assembly Platform Sostar M5 1
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Send Inquiry to this Member

Shenzhen Shuttle Star Industrial Co., Ltd

10F Beifangjunyi Building,Xingwei Road,Fuyong Street,Bao'an District,Shenzhen ,P.R China

Phone:
86-0755-27513884
Fax:
86-0755-27513017
Contact:
Lilly (Sales Manager)
Mobile:
18820220117

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