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RFID flip-chip bonder 1
  • RFID flip-chip bonder 1

RFID flip-chip bonder

Model:RFM500
Brand:caina
Origin:Made In China
Category:Industrial Supplies / Machinery / Hydraulic Pressure Machine & Parts
Label:RFID bonder , flip-chip bonder , RFID testing machine
Price: US $20000 / set
Min. Order:1 set
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Member Information

Detail

Product Description

http://www.chinarfid.biz/sell-3878455-rfid-flip-chip-bonding-machine-rfm500.html

Specifications:

Dimension: 620mm*650mm*680mm

Weight:75KG

Power:300W

Barometric Pressure: 5 bar≤P≤7 bar

Mechanical Controlling:Anisotropic electro-conductively paste,Manual material loading,Manual Focusing, Manual chip attaching,and transfer to hot-pressing.

Pressure Range;50-200g±1g

Work piece:Antenna≤100mm*80mm

Chipset 0.3mm*0.3mm-2mm*2mm

Video: One visual orientation system

Bonding Accuracy:±25um

Substrate Material:PET PVC  PAPER

Glue Type:ACA NCA ICA 


Product Image

RFID flip-chip bonder 1
Img 1

Send Inquiry to this Member

shenzhen CaiNa Semiconductor Equipment Co.,Ltd

Block 14 tianliao industrial tanglang Nanshan distract shenzhen china www.chinarfid.biz

Phone:
86-755-26010862
Fax:
86-755-18603071612
Contact:
Joney (sales manager )
Mobile:
18603071612

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