flip-chip bonding equipment
Product Description
RF-4000 is a upgrade equipment of RF-2000. through hot press to solidify and package, roll feeding, automatically pick and paste the chip, auto receiving system, Sophisticated pressure controlling system and tongs can improve the yield of product. It's a high technology equipment concentrated optical, mechanical, electrical, air and liquid fileds. Adaptable for different kinds of electronic label assembling.
Dimension
6000mm*1600mm*2250mm
Weight
3000 kg
Power
2800 w
Barometric pressure
5 bar≤P≤7 bar
Pressure range
50—300g
Accommodated work piece
Antenna ≤100mm×80mm
Chipset 0.4mm×0.4mm~2mm×2mm
Temperature range
50—300 ℃
Vision system
Vision position system, chip and antenna automatically positioning
Additional function
Inlay testing system
Throughput
4000 pcs/hr
Paster accuracy
±25 μm
Substrate Material
PET PVC PAPER
Adhesive
ACA NCA ICA
Product Image
Img 1
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