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flip-chip bonding equipment 1
  • flip-chip bonding equipment 1

flip-chip bonding equipment

Model:RFM4000
Brand:CAINA
Origin:Made In China
Category:Industrial Supplies / Machinery / Separation Equipment
Label:flip-chip bonder , rfid equipment , RFID testing equipme
Price: US $1 / set
Min. Order:1 set
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Detail

Product Description

RF-4000 is a upgrade equipment of RF-2000. through hot press to solidify and package, roll feeding, automatically pick and paste the chip, auto receiving system, Sophisticated pressure controlling system and tongs can improve the yield of product. It's a high technology equipment concentrated optical, mechanical, electrical, air and liquid fileds. Adaptable for different kinds of electronic label assembling.
Dimension
6000mm*1600mm*2250mm
Weight
3000 kg
Power
2800 w
Barometric pressure
5 bar≤P≤7 bar
Pressure range
50—300g
Accommodated work piece
Antenna ≤100mm×80mm
Chipset 0.4mm×0.4mm~2mm×2mm
Temperature  range
50—300 ℃
Vision system
Vision position system, chip and antenna automatically positioning
Additional function
Inlay testing system
Throughput
4000 pcs/hr
Paster accuracy
±25 μm
Substrate Material
PET   PVC   PAPER
Adhesive
ACA   NCA   ICA


Product Image

flip-chip bonding equipment 1
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shenzhen CaiNa Semiconductor Equipment Co.,Ltd

Block 14 tianliao industrial tanglang Nanshan distract shenzhen china www.chinarfid.biz

Phone:
86-755-26010862
Fax:
86-755-18603071612
Contact:
Joney (sales manager )
Mobile:
18603071612
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