LGA 1150/1151/1156 Bonded fin heat sink/heat pipe
Product Description
Product Description
1 Product Size:89*89*21
2 Weight:188g
3 Material:Aluminum fin+heat pipes
Product Feature
1 Aluminum combined with copper,will make thermal effect more obvious.
2 Stacked aluminum fin,conductive material will make it more better.
Product Specification/Models
NT001N5-01
Application
Intel® Core™ i7-2600, i5-2500 series Intel® Core™ i3& i5,Xeon® Processor 3400 Series
Other Information
OEM ODM is welcome,10 years manufacture experience.
Application to LGA 1150/1151/1155/1156
| Payment Terms: | Western Union,Paypal |
| |
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