Model: | - |
---|---|
Brand: | SEPNA |
Origin: | - |
Category: | Chemicals / Other Chemicals |
Label: | two-part silicone , led silicone selant , silicone adhesive |
Price: |
US $8.7
/ pc
|
Min. Order: | 1000 pc |
Last Online:02 Jun, 2016 |
SI2200 is two-component white color silicone potting adhesive. The mixture has a good fluidity, can vulcanize to deep layer in room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied components.
Features
1.Two-part addition type silicone adhesive
2. Low hardening shrinkage
3. Excellent electrical insulation in high temperature and stability
4. Excellent adhesion, cured the longer, the better adhesion
5. Good waterproof and moisture resistance
Usage
Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box, Magnetic induction coils, Ceramic electrode, Vacuum circuit breaker, etc.
Data Table
PROPERTY |
STANDARD/UNITS |
VALUE of SI2200 |
|
---- |
---- |
PART A |
PART B |
Color |
Visual inspection |
white viscous liquid |
Colorless transparent fluid |
Viscosity |
25°C, cps |
9,500 |
750 |
Density |
25°C, g/cm3 |
1.55 |
0.98 |
Mixture ratio |
Mass ratio |
A:B=100:10 |
|
Viscosity of mixture |
25°C, cps |
4,300 |
|
Mixture density |
25°C, g/cm3 |
1.40 |
|
Operation time |
25°C, min |
60 |
|
Cure condition |
RTV/HEAT |
25°C/ 6 hour; 80°C/ 30min |
|
Cured appearance |
---- |
White elastomer |
|
Hardness |
Shore A |
55 |
|
Shear strength |
MPa |
1.4 |
|
Thermal conductivity |
W/mK |
0.80 |
|
Dielectric strength |
kV/mm, 25°C |
≥22 |
|
Volume resistance |
DC500V, ohm-cm |
1.1×1015 |
|
Loss factor |
1 MHz |
<0.008 |
|
Dielectric constant |
1 MHz |
<3.00 |
|
Application temperature |
°C |
-60~260
|
Note:Above operation time and curing time was resulted based on 110g mixture, all data of cured state were tested after 7 days curing under 25°C, 55%RH.
Operation
1. Mixing uniformity in the packing before using, as there’s part of filler sedimentation happens during storage.
2. Mix Part A and Part B by 10:1 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements. It’s recommended to slowly pour along the walls of the implements, so as to reduce the bubbles happens.
3. Still the potted component to let out the bubbles. Can be cured by heat, about 30 minutes in 80°C. If cured under room temperature, about 6 hours.
lVacuum defoaming can improve the performance of cured product.
lSeal the remaining products tightly after use.
lLow temperature will slow the curing speed, overheating will lead to curing speed too fast. Keep the constant temperature in workshop is recommended.
lIt's hard for SI2220 to cure if contact with sulfur, amine, organotin.
Package & Storage
Part A--10 KG/Bucket, Part B--1 KG/ Pot.
When stored at or below 25°C in the original unopened containers, this product has a usable life of 12 months from the date of production. It’s non-dangerous goods, can be transported and stored as normal chemicals.