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 Here we provide 7 types of most competitive wire bonder, 4 Types of manual wire bonder, and 3 types of automatic wire bonder.

      And the 3 automatic:  automatic thin aluminum wire bonder MD-Etech1850(18-50um aluminum wire); automatic ball bonder MD-S800(15-50um Au or alloy wire); automatic heavy wire bonder MD-CWX-3710(125-500um Aluminum wire).

     The most competitive 4 types:thin aluminum wire wedge bonder  MDB-2575(25-75um aluminum wire);Wire wedge bonder MDB-25125(25-125um aluminum wire); heavy aluminum wire wedge bonder MDB-7550(75-500um aluminum wire);gold wire ball bonder MDBB-1750(17-50um gold wire). they are very popular for samll quantity production, school,institution,research department.

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1: Automatic aluminum wire wedge bonder MD-Etech1850:

Specification:

Application: LED,COB,Integrated circuit,Semiconductor 

Wire diameter:0.7mil-2.0mil

XY travel:4’’*4’’

Z travel:0.4’’

Resolution:0.02mil

Bonding angle:30 degree

Bonding force:15-200g

Bonding power:0-2w

Bonding time:programmable

Bonding head clearance:4.8mm

UPH:14K(based on 2mm wire length)

Alignment Reference:

Die: 0.1 or 2 points;Substrate:0.1 or 2 points

Image recognition system

Optical microscope:10-30X

Voltage:110v/220v 50Hz

Power:800w

Program storage:1000wires/chip,1000chips/program,99programs

Dimension:760*820*1450mm

Weight:280kg

2, Automatic ball bonder MD-S800

Character:

Application:IC(SOP,SOT,DIP,BGA,COB),LED(SMD,COB,High power,Integration)

Bonding principle: ultrasonic.

System:windows XP based.

Min wire diameter:0.5mil.

Language:Chinese/english

Wire material:gold/copper/alloy/silver.

Specification:

Bonding speed:50ms/wire

Bonding accuracy:+-3.0um

Wire length:Max:8mm

Wire diameter:15-50um

Bonding area:56-65mm

Bonding type:single wire/BSOB/BBOS

XY resolution:0.1um

Transducer system:138khz

PR accuracy:+-0.37um(4x),+-0.74(2x)

Applicable magazine:

L:120-305mm  W:45-98mm H:50-180mm

Magazine pitch:Min:1.4mm

Applicable lead frame:

L:100-300mm W:40-90mm T:0.1-1.3mm

Voltage:190-240V 50Hz

Compressed air:0.6-0.97bar

Air consumption:80L/min

Dimension:1230*940*1660mm

Weight:800kg

3:Automatic heavy wire bonder MD-CWX-3710:

The main technical specifications:

Power supply: 220 vac plus or minus 10%, 50 hz, reliable grounding, maximum rate of about 800 w

Drive source: 4 ~ 6 kg/C m²

Ultrasonic power: 0 ~ 30 w, one, two welding automatic switching

Weldable aluminium silk diameter: 125 ~ 500 um (5 ~ 20 mil)

Welding time: 10 ~ 500 ms, 2 channel

Welding stress: 30 ~ 1200 g, 2 channel

Welding speed: about 1300 ~ 1300 / h (TO - 220 double)

Welding Angle: - 90 ~ 90 degrees

The visual system: PR microscope magnification of 0.5 times

PR floodlight: white light, brightness is adjustable

Shape size: 1260 mm * 1860 mm * 760 mm

Weight: 480 kg