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Automatic Thin Wire Wedge Bonder MD-Etech1850 1
  • Automatic Thin Wire Wedge Bonder MD-Etech1850 1

Automatic Thin Wire Wedge Bonder MD-Etech1850

Model:MD-Etech1850
Brand:MINDER
Origin:Made In China
Category:Electronics & Electricity / Electronics Stocks
Label:k&s wire bonder , wire bonding machine , asm wire bonder
Price: US $1 / pc
Min. Order:1 pc
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Member Information

Detail

Guangzhou Minder-Hightech Co., Ltd

Free MemberGuang Dong - China
Last Online:15 Jul, 2016

Product Description

Here we provide 7 types of most competitive wire bonder, 4 Types of manual wire bonder, and 3 types of automatic wire bonder.

      And the 3 automatic:  automatic thin aluminum wire bonder MD-Etech1850(18-50um aluminum wire); automatic ball bonder MD-S800(15-50um Au or alloy wire); automatic heavy wire bonder MD-CWX-3710(125-500um Aluminum wire).

     The most competitive 4 types:thin aluminum wire wedge bonder  MDB-2575(25-75um aluminum wire);Wire wedge bonder MDB-25125(25-125um aluminum wire); heavy aluminum wire wedge bonder MDB-7550(75-500um aluminum wire);gold wire ball bonder MDBB-1750(17-50um gold wire). they are very popular for samll quantity production, school,institution,research department.

     Click here to view all product.

1: Automatic aluminum wire wedge bonder MD-Etech1850:

Specification:

Application: LED,COB,Integrated circuit,Semiconductor 

Wire diameter:0.7mil-2.0mil

XY travel:4’’*4’’

Z travel:0.4’’

Resolution:0.02mil

Bonding angle:30 degree

Bonding force:15-200g

Bonding power:0-2w

Bonding time:programmable

Bonding head clearance:4.8mm

UPH:14K(based on 2mm wire length)

Alignment Reference:

Die: 0.1 or 2 points;Substrate:0.1 or 2 points

Image recognition system

Optical microscope:10-30X

Voltage:110v/220v 50Hz

Power:800w

Program storage:1000wires/chip,1000chips/program,99programs

Dimension:760*820*1450mm

Weight:280kg

 

2, Automatic ball bonder MD-S800

  

Character:

Application:IC(SOP,SOT,DIP,BGA,COB),LED(SMD,COB,High power,Integration)

Bonding principle: ultrasonic.

System:windows XP based.

Min wire diameter:0.5mil.

Language:Chinese/english

Wire material:gold/copper/alloy/silver.

Specification:

Bonding speed:50ms/wire

Bonding accuracy:+-3.0um

Wire length:Max:8mm

Wire diameter:15-50um

Bonding area:56-65mm

Bonding type:single wire/BSOB/BBOS

XY resolution:0.1um

Transducer system:138khz

PR accuracy:+-0.37um(4x),+-0.74(2x)

Applicable magazine:

L:120-305mm  W:45-98mm H:50-180mm

Magazine pitch:Min:1.4mm

Applicable lead frame:

L:100-300mm W:40-90mm T:0.1-1.3mm

Voltage:190-240V 50Hz

Compressed air:0.6-0.97bar

Air consumption:80L/min

Dimension:1230*940*1660mm

Weight:800kg

 

3:Automatic heavy wire bonder MD-CWX-3710:

The main technical specifications:

Power supply: 220 vac plus or minus 10%, 50 hz, reliable grounding, maximum rate of about 800 w

Drive source: 4 ~ 6 kg/C m²

Ultrasonic power: 0 ~ 30 w, one, two welding automatic switching

Weldable aluminium silk diameter: 125 ~ 500 um (5 ~ 20 mil)

Welding time: 10 ~ 500 ms, 2 channel

Welding stress: 30 ~ 1200 g, 2 channel

Welding speed: about 1300 ~ 1300 / h (TO - 220 double)

Welding Angle: - 90 ~ 90 degrees

The visual system: PR microscope magnification of 0.5 times

PR floodlight: white light, brightness is adjustable

Shape size: 1260 mm * 1860 mm * 760 mm

Weight: 480 kg 

 

Click here or below popho to see more kind of bonders:

 

Packaging & Shipping

ABOUT PACKAGING:

First we use foam and paper package,and second we use plywood box to cover, ensure there willl be no 

injury during delivery. as below:

ABOUT SHIPPING:

First, usually we quote an EXW price, the shipping method should be discussed. we have tried fast forward 

as DHL, and have tried by air, and by land to Russia, also by sea. also we are glad to support customer's own

forwarder.

 

company introduction

      Guangzhou Minder-Hightech Co.,Ltd(main web page: minder-hightech.en.alibaba.com/www.minder-hightech.com) is focused on connection(welding).

      We are comprised by a group of high educated specialists,with the leader of overseas professor, some of us have more than 20 years welding experience,our goal is to provide high performance product but low price and exceeded service.

      We care for the safety of operator, this year, we developed a safety system in spot welding industry named SOFT TOUCH system,which can prevent heavy pinch point injury.

      We are specialized in most of the connection(welding) technics,the most application we have participated in are electronic component(resistance,capacitor,inductor),chip on board,automotive electronic accessories,cell phone,IC cards,motor armature commutator etc.By material, we have engaged in connecting the Aluminum, Copper, Brass, Au(gold), Platinum, Nickel, Enameled wire, etc.

       We also provided the full IC package line; and LED producing line; Crystal oscillator producing line; as well as the wafer machining equipment.

       Our product are classified into resistance spot welding,inverter seam welding, ultrasonic wire bonding,hot bar soldering,automatic TIN soldering,stud welding, all the product are with mature latest technology,high performance,high precision,and high reliability.

       At the same time, we maintain a good relationship with the high school scientific research institution,we know the newest connection(welding) technology direction all over the world, committed to give out the best connection(welding) solution to our global customer.

       We chose the most open and industrialized city-guangzhou-to be our base head place,to ensure the efficiency and rapidly response.

       These years,we proud of our growth with the famous company such as TPT,K&S,ASM,Bosch,Miyachi,Uniteck,Avio,Apollo,LPKF etc.


Product Image

Automatic Thin Wire Wedge Bonder MD-Etech1850 1
Img 1

Send Inquiry to this Member

Guangzhou Minder-Hightech Co., Ltd

No. 1, Xingya 3rd Road, Panyu District, Guangzhou, Guangdong, China (Mainland)

Phone:
86-15813334038
Fax:
86
Contact:
Minder Hu (sales manager)
Mobile:
15813334038

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