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HY-210 Condensation Cure Electronic Potting Silicone Rubber

Description

HY-210 can be applied to the sealing and pouring of various electronic components, and then forming insulation system with no corrosion and negligible shrinkage.

Application

HY-210 is suitable for bonded seal of electronic components, power module and control module, LED invertor potting, etc which requires waterproof and insulation. It can be broadly used for LED screen, Wind Power Generator, PCB, substrate, etc. 

Technical Parameters  

Characteristics

Room temperature vulcanize, and easy to operate;

Maintain flexibility at a wide temperature range, and excellent insulation performance;

Waterproof, moisture-proof, mouldproof, dustproof, and stable components;

Resistance to Chemical dielectric, anti-yellowing, resistance to climate ageing.

Operation instructions

1, Pls put part A and part B in separate container and stir evenly before mixing the two part together.

2, Weight Ratio: part A: part B = 1:1

3, Deaeration the mixture under 0.08 MPa for 3 minutes.

4, The temperature influences the curing time of 9301. When in too low temperature, we s est customers appropriately heat the mixture to accelerate vulcanization.

Warm tips :

1.The following material may hinder the curing of the product, So pls apply after summary experiment. When necessary, pls clean the application areas.

Condensation silicone which not completely cured or organic tin compounds

Sulphur, sulfide and sulfur rubber materials.

Amine compounds as well as contains the amine materials.

Pewters solder flux.

2. Should be sealed storage.The mixture should be used up at once, avoid causing waste.

3. Silicone belongs to non-dangerous goods, but keep away from mouth and eyes.