| Model: | CWVC-6 |
|---|---|
| Brand: | Chuangwei |
| Origin: | - |
| Category: | Industrial Supplies / Machinery / Separation Equipment |
| Label: | Cutting Pcb Board , Depanelize Pcba , PCB Cutter |
| Price: |
-
|
| Min. Order: | 1 Set |
| Last Online:08 Oct, 2021 |
High Accuracy FPC / Rigid - Flex PCB Laser depaneling machine,CWVC-6 Description:
|
Product Name: |
Laser Pcb Separator |
Super: |
Low Power Consumption. |
|
Laser: |
12/15/17W |
Laser Brand: |
Optowave |
|
Power: |
220V 380v |
Warranty: |
1 Year |
Advantages of Laser Fpc Cutting/singulation:
No mechanical stress on substrates or circuits
No tooling cost or consumables.
Versatility – ability to change applications by simply changing settings
Fiducial Recognition – more precise and clean cut
Optical Recognition before PCB depaneling/singulation process begins.
Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)
Extraordinary cut quality holding tolerances as small as < 50 microns.
No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards
Challenges of Depaneling using Routing/Die Cutting/Dicing Saws:
· Damages and fractures to substrates and circuits due to mechanical stress
· Damages to PCB due to accumulated debris
· Constant need for new bits, custom dies, and blades
· Lack of versatility – each new application requires ordering of custom tools, blades, and dies
· Not good for high precision, multi-dimensional or complicated cuts
· Not useful PCB depaneling/singulation smaller boards
Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.
PCB (printed circuit board) Depaneling using UV Laser,CWVC-6 Specification:
|
Laser |
Q-Switched diode-pumped all solid-state UV laser |
|
Laser Wavelength |
355nm |
|
Laser Power |
10W/12W/15W/17W@30KHz |
|
Positioning Precision of Worktable of Linear Motor |
±2μm |
|
Repetition Precision of Worktable of Linear Motor |
±1μm |
|
Effective Working Field |
460mmX460mm(Customizable) |
|
Laser Scanning Speed |
2500mm/s (max) |
|
Galvanometer Working Field Per One Process |
40mmх40mm |
|
Laser class |
1 |
|
Max. working area (X x Y x Z) |
300 mm x 300 mm x 11 mm |
|
Max. recognition area (X x Y) |
300 mm x 300 mm |
|
Max. material size (X x Y) |
350 mm x 350 mm |
|
Data input formats |
Gerber, X-Gerber, DXF, HPGL, |
|
Max. structuring speed |
Depends on application |
|
Positioning accuracy |
± 25 μm (1 Mil) |
|
Diameter of focused laser beam |
20 μm (0.8 Mil) |
|
Laser wavelength |
355 nm |
|
System dimensions (W x H x D) |
1000mm*940mm
|
|
Weight |
~ 450 kg (990 lbs) |
|
Power supply |
230 VAC, 50-60 Hz, 3 kVA |
|
Cooling |
Air-cooled (internal water-air cooling) |
|
Ambient temperature |
22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
|
|
Humidity |
< 60 % (non-condensing) |
|
Required accessoires |
Exhaust unit |
PCB Laser Depaneling Machine with UV Laser,CWVC-6 Cutting Application:
FPC and some relative materials;
FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.
PCBa Cutting by Using UV Laser Pcb Separator Machine Sample Video
| Payment Terms: | TT/LC |
|---|---|
