High Quality Diamond Back Grinding Wheel For Silicon Slice Thinning
Product Description
Advantage:
Minimized wafer edge chipping/improved die strength,Excellent grinding ablity with high feed/Applicable thin wafer
Sail series grinding wheels employ a new porous vitrified bond with excellent swarf removal capability as well, the new bond feeds in the wheel coolant water in order to grind extremely hard SiC wafers. Grinding with a fixed abrasive produces a surface roughness approaching a polish. Grinding can be performed on tape mounted wafers making it unnecessary to use wafer carriers. The total process is much easier compared to a slurry processes
Sail series grinding wheels
1. excllent quality.
2, steady working
3. long life time.
4. high performance
Specification:
http://www.sail-abrasives.com
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