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8Layers HDI PCB FR4 Tg170 Impedance Control BGA 18Layers HDI PCB FR4 Tg170 Impedance Control BGA 28Layers HDI PCB FR4 Tg170 Impedance Control BGA 3
  • 8Layers HDI PCB FR4 Tg170 Impedance Control BGA 1
  • 8Layers HDI PCB FR4 Tg170 Impedance Control BGA 2
  • 8Layers HDI PCB FR4 Tg170 Impedance Control BGA 3

8Layers HDI PCB FR4 Tg170 Impedance Control BGA

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Category:Electronics & Electricity / Electronic Components / Circuit Board
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Min. Order:1 pc
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Shenzhen Bente Circuit Limited

Free MemberGuang Dong - China
Last Online:07 Nov, 2017

Product Description


Product Description:








PCB industry, PCB layout guidelines, buy PCB, Thick board 8 Layers PCB, HDI PCB, Bare board.  Base Material is FR4 Tg170.  2.4mm0.18mm Board Thickness. Surface Treatment is ENIG 2u". 5 groups of Impedance Control +/-10%. Technical Features is 6 BGA & Minimum PAD of BGA is 0.2mm. It is mainly used in Communications & Computer. Ship by DHL, FEDEX, UPS, TNT or client specified. Pay with popular and secure payment methods, such as PayPal, Telegraphic Transfer, etc. Our PCB products are mainly used in these fields: Power Electronics, Communications, Industrial Control, Medical Electronics, Security Electronics, Consumer Electronics, Computer, Automotive Electronics, etc. 


Good News: Every orders will get free SMT stencil, please check out our website at www.bentepcb.com/onlinepcb.html.












HDI PCB:


High Density Interconnects (HDI) are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation).


HDI Circuit boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.


They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards.





Andwin maintains years of experience with HDI products and was a pioneer of second generation microvias. now offer an entire family of microvia technology solutions for your next generation products.


Stack up of HDI PCB


Stack up of 1  Step HDI PCB









Stack up of 2 step HDI PCB









Stack up of  2 steps HDI with blind via and buried via


 





Anylayer connect of HDI PCB, need to adjust drill








About Us:


BentePCB is a professional PCB manufacturing which is focus on double side, multilayer, HDI PCB, rigid PCB and flexible PCB mass production. The company was established on 2011.
We have two factories together, The factory in Shenzhen is specialized in small and middle volume orders and the factory in Jiangxi is for big volume.


Why Us?


UL (E492586), ISO9001,  ISO14001, TS16949, RoHS certified.
Turnover USD 10-50 million per year.
15,000 sqm area, 450 staff .
Mass Production from single to 16 layers.
Special Material:ROGERS, Arlon, Taconic.etc.
Client:Huawei, SAMSUNG, Malata, Midea,Texas Instruments.etc.






Certification(UL:E492586, TS16949, ISO14001, ISO9001,RoHS):






Factory Tour:














Exhibition:





We Took part in the famous exhibitions over the past years,and got highly appreciation from the top experts,as well as cooperated tightly with them.






Delivery:


BentePCB offers flexible shipping methods for our customers, you may choose from one of the methods below.








We don`t just sell PCBs .We sell sleep.



http://www.bentegroup.com

Product Image

8Layers HDI PCB FR4 Tg170 Impedance Control BGA 1
Img 1
8Layers HDI PCB FR4 Tg170 Impedance Control BGA 2
Img 2
8Layers HDI PCB FR4 Tg170 Impedance Control BGA 3
Img 3

Send Inquiry to this Member

Shenzhen Bente Circuit Limited

GuangdongShenzhen 9-10 Building, Gangbei Industrial Park, Huangtian Village, Bao'an District, Shenzhen, China

Phone:
86-0755-83393378
Fax:
86-0755-83422990
Contact:
Darren Peng (CEO)
Mobile:
18588450257

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