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The final step of the encapsulated IC is to load the finished IC into the antistatic plastic pipe for storage, and the IC of the filling tube needs to be sealed so that IC will not fall out. At present, many semiconductor packaging and testing enterprises adopt artificial IC material tube sealing packaging, which is not only slow, but also may damage the good product because of the problem. The semi-automatic IC nailing machine can solve this problem very well, so as to reduce the operation cost of the production enterprise, improve the production efficiency and the product packaging quality.