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Product Description

Selective Soldering System

Hanson Selective Soldering System is a top-quality products, giving us a real sense of the production innovation, reduced cycle times, reduced labor costs, improved welding quality of PCB through-hole components. System maintenance is extremely simple, innovative tin pool and pump designed for minimum waste of generated slag. Air Pump is cleaned more frequently, every 80 hours of production cycle. SMS1000 features reliability and flexibility (for high-mix, high-volume production), the most important thing is, Hanson excellent after-sale service provide a strong guarantee to our production.
 

Feature

* Diversified welding manner
* Less thermal shock with components
* Optimize welding spot
* Multiple solder nozzles
* Independent Nitrogen heating system
* For lead and lead-free solder quick-change
* Sample Offline programming software
* camera monitor system

 

Product Paramenters

Management of PCB conveyor
PCB Maximum size 350*450mm(customizable)
PCB Minimum size 25*75mm
General PCB fixture Available for sketch plate
PCB Maximum weight 6kg
Edge clearance 3mm
SMEMA port (input/output) yes
Max height of components (top of PCB) 100mm
Max height of components (bottom of PCB) 50mm
Speed of conveyor programmable
Max speed of conveyor 250 mm/second
Width of conveyor adjustable and controlled by motor
Automatic PCB fixture yes

Movement management
Electronic machine closed loop servo motor
X/Y/Z repeatable accuracy +/- 0.05mm

Solder management system
Quick-change solder pool and solder pump Available
Lead/lead-free application Available
Quick-change magnetic nozzle Available
Independent Nitrogen heating Standard
Solder pool capacity 16 kg / 35 lbs
Inspection of soldering liquid level Available
Operating temperature range 250-350 degrees C

Preheating
Preheating power 10KW
Preheating area 350mm*450mm

Solder nozzle
Nozzles 2, 2.5, 3, 4, 5, 8mm
Soldering height / largest pin 6 mm
Solder stability + / -0.25 mm
Components keep-away distance 1.5 mm
Gaussian nozzle range Maximum 30 mm
Traditional wave nozzle 30 mm -100 mm (options)
Wave height / tilt 6 mm / 0 - 10 ° tilt fixture(options)

Flux spray management
Spray 3 - 30mm
Flux drop jet 0.75 - 2.5mm
Inspection of soldering liquid level Available

Maintenance
Low maintenance design Clean solder pump every 80 hours

Security
Exhaust 150CFH
CE Certificate Available

Soldering requirement
Nitrogen purity High purity <20PPM oxygen
Nitrogen flow / pressure 30SCFH @ 80PSI for each nozzle
Power 240VAC/50-60 Hz / 25 Amps / Single Phase
Gas source 80PSI

Appearance
Dimensions (W * D * H) 1300×1330×1300mm
Net weight 360 kg
Floor space requirements 3 m²