| Model: | HI-FLOW 300P |
|---|---|
| Brand: | BERGQUIST |
| Origin: | Made In United States |
| Category: | Electronics & Electricity / Electric Parts & Materials |
| Label: | BERGQUIST HF300P , HI-FLOW THF 1600P , HI-FLOW 300P |
| Price: |
US $1
/ pcs
|
| Min. Order: | 10 pcs |
| Last Online:09 Jun, 2021 |
Bergquist HF300P,HI-FLOW THF 1600P,HI-FLOW 300P
Bergquist HF300P Features and Benefits
• Thermal impedance: 0.13°C-in. 2 /W
(at 25 psi)
• Field-proven polyimide film; excellent
dielectric performance; excellent cut-
through resistance
• Outstanding thermal performance in an
insulated pad
BERGQUIST HI-FLOW THF 1600P consists of a thermally conductive 55°C phase change compound coated on a thermally conductive polyimide film. The polyimide reinforcement makes the material easy to handle and the 55°C phase change temperature minimizes shipping and handling problems.
BERGQUIST HI-FLOW 300P achieves outstanding values in voltage breakdown and thermal performance. The
product is supplied on an easy release liner for exceptional handling in high volume manual assemblies. BERGQUIST
HI-FLOW 300P is designed for use as a thermal interface material between electronic power devices requiring
electrical isolation to the heat sink.
BERGQUIST HF300P Typical Applications Include:
• Spring or clip-mounted
• Discrete power semiconductors and modules
Configurations Available:
• Roll form, die-cut parts and sheet form, dry both sides
