Model: | - |
---|---|
Brand: | Yingstar |
Origin: | - |
Category: | Electronics & Electricity / Electric Parts & Materials |
Label: | PCB Assembly , Low volume |
Price: |
US $2
/ pc
|
Min. Order: | 1 pc |
Last Online:22 Sep, 2021 |
Supplier: Yingstar Electronics
Layers: 2PCB:FR-4/1.6mm, 1oz finished copper
Surface Treatment: HASL
PCBA Lead time:3-4 weeks
Packing: bubble bag and regular carton
Twist: <0.75%
[Description]
1, PCB Assembly, PCB fabrication / PCB layout, PCB re-layout.
2, Electronic Manufacturing Service.
3, SMT&DIP&PTH&BGA.
4, Components Sourcing.
5, Quick PCBA prototype.
6,Visual Inspection, AOI Inspection( for normal SMD package parts), X-Ray Inspection( for BGA and QFN package chips), Voltage Test, ICT Test and Functional test ( can guarantee all boards qualified before delivery)
7, Sample and small batch order are accepted.
PCBA Service
Customer offers: Gerber file, PCB Specification, BOM and Assembly Drawing.
Full-turnkey PCBA: 1-30Layers PCB, Components Sourcing, SMT, PCBA testing, PCBA Packing and PCBA Shipping.
PCBA Quality Assurance
1, Certifications: IPC-A-610 Class 2 and IPC-A-610 Class 3,ISO9001.
2, 7 lines dust-proof SMT lines and DIP lines.
3, All line workers wear anti-static and dust-proof clothing.
4, All operators should pass strictly training before they start work.
5, SMT Equipment:solder paste printer in Jidakang,, Mounter in Panasonic, Re-flow, Wave Soldering and Semi-auto DIP
6, PCBA Test Equipment: ORT, Constant temperature and humidity chamber,3D CMM,X-Ray.
7, PCBA Test:ICT, Functional Circuit Test and X-ray test.
8, Package Processed:
0201,0402, 0603, 0805, 1206, 1608, 2125, 3216
Micro QFP 0.2mm
Flip-chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP
10, Materials: HiTg FR4 (Fr4 Tg170℃) ,Fr1,CAM3
11, Material Brand:Kemet, Vishay, Panasonic and so on
PCBA Lead Time
PCBA prototype: 10-15 working days after contract signed and EQ confirmed.
Mass production: partial delivery according to the customer’s requirement.
Other information for PCBA
1, The mass production will be arranged after PCBA prototype confirmed.
2, Use Teflon adhesive tape to protect Mount Holes and GND Holes.
3, EPE is used to avoid impact and crash.
PCBA Standard Packing: bubble bag and regular carton