Home > Products > Electronics & Electricity > Insulation Material

BERGQUIST BP108 BOND-PLY 100 BOND-PLY TBP 850   

BERGQUIST BOND-PLY 100 Configurations Available:

• Sheet form, roll form and die-cut parts

Shelf Life: The double-sided, pressure sensitive adhesive used in BOND-PLY products

requires the use of dual liners to protect the surfaces from contaminants. Henkel

recommends a 6-month shelf life at a maximum continuous storage temperature of

35°C or 3-month shelf life at a maximum continuous storage temperature of 45°C, for

maintenance of controlled adhesion to the liner. The shelf life of the BOND-PLY material,

without consideration of liner adhesion (which is often not critical for manual assembly

processing), is recommended at 12 months from date of manufacture at a maximum

continuous storage temperature of 60°C.

BERGQUIST BP100  Typical Applications Include:

• Mount heat sink onto BGA graphic

processor or drive processor

• Mount heat spreader onto power

converter PCB or onto motor control PCB