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 5.0 W/mK thermal conductivity  

 Low pressure versus deflection  

 Excellent surface wetting for low contact resistance  

 Minimizes board and component stress  

 Option for additional electrical isolation and tear resistance 

  Environmentally friendly solution that meets regulatory requirements including RoHS and  REACH

LAIRD Tflex HD700 thermal gap filler combines 5 W/mK thermal conductivity with superior pressure  versus deflection characteristics. 

The combination will allow minimal stress on components  while also yielding low thermal resistance. As a result, less mechanical and

 thermal stresses will  be experienced within your device.  Tflex HD720 PI can be provided with an integrated polyimide film on one side. 

This liner  provides numerous application benefits like electrical isolation, placement ease during  assembly, and tear resistance for applications

 that require shear.  Tflex HD720 and Tflex HD700PI are available in thickness from 0.5mm (0.020”) to 5mm  (0.200”). 

The standard material LAIRD Tflex HD700 material is a light pink color, but we do have the  option to provide this in a grey color if a neutral color is desired (Tflex HD700,GR).