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DOCBOND|Underfill DB840B 1DOCBOND|Underfill DB840B 2DOCBOND|Underfill DB840B 3
  • DOCBOND|Underfill DB840B 1
  • DOCBOND|Underfill DB840B 2
  • DOCBOND|Underfill DB840B 3

DOCBOND|Underfill DB840B

Model:DB840B
Brand:Underfill DB840B
Origin:Made In China
Category:Chemicals / Adhesives & Sealants
Label:DOCBOND
Price: -
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Member Information

Detail

HUIZHOU DOCBOND NEW MATERIAL CO.,LT

Free MemberGuang Dong - China
Last Online:18 Apr, 2023

View all products. (20)

Product Description

DB840B

The Underfill is a one-component epoxy sealant for CSP or BGA underfill  processes. It can form a consistent and non-defective underfill layer, which  can effectively reduce the impact caused by mismatching of overall  temperature expansion characteristics between the silicon chip and the  substrate or external forces. Fast curing when heated. The lower viscosity  characteristics allows for better underfilling; and good reworkability.


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DOCBOND|Underfill DB840B 1
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DOCBOND|Underfill DB840B 2
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DOCBOND|Underfill DB840B 3
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Send Inquiry to this Member

HUIZHOU DOCBOND NEW MATERIAL CO.,LT

No. 628, Jiushui East Road, Laoshan District

Phone:
86-752-5587120
Fax:
86-752-5587776
Contact:
Qingdao Docbond New (Marketing Director)
Mobile:
18927329853

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