Home > Products > Chemicals > Other Chemicals

1.Description:

Interflux®IF 2005M is a low solids noclean flux, designed to evaporate during the soldering process. This means also the safest no-clean flux for hightech circuits. With no rosin nor resin present to create a sticky residue, there is nothing left after wave soldering to foul test pins or prevent electrical contact.  Furthermore, machine and carrier pollution are very little compared to other fluxes.

This absolutely halide free flux meets all Bellcore and IPC requirements and is QPL- listed (approved to MIL-F-14256F). It is formulated to provide the best combination of solderability, ease of processing and reliability. Great solderability on HAL, Ni Au, I-Sn, I-Ag and OSP coated PCB’s.

2. Physical and chemical properties

Appearance:Clear colourless liquid

Solid content:1,85% ± 0,15%

Density at 20°C:0,807—0,809 g/ml

Acid number:14 – 16 mg KOH/g

3.Preheating

Interflux IF2005M The recommended preheat temperature measured

on the topside of the boards is 80°C-130°C. This value is retrieved from field experience. The flux can have lower preheating temperatures but the solvent should be evaporated before wave contact. The flux can have higher preheating temperatures but beware not to exhaust the flux. If possible avoid hot air convection preheating temperatures above 150°C. Preheat slope: 1-3°C/s .OSP finished boards can benefit with enough flux, lower preheat temperatures and high solder pressure on the (first) wave to get good through hole filling.

4.Interflux®IF 2005M Wave contact

Typical wave contact or dwell time value is 3-4s when using a single solder wave. For double wave soldering systems typical values are 1-2s for the first wave and 2-4s for the second wave. Lower total dwell time limit is 2s. Solder wetting can be optimal at lower contact times however longer contact times facilitate total flux wash off from

the boards. The maximum upper limit will be determined by flux exhaustion and physical limitations of the board and components. Indications for flux exhaustion are bridging, icicling, webbing,...

5.Handling

Storage

Store the flux in the original packaging, tightly sealed at a preferred temperature of +5° to +25°C

Safety

IF 2005M is flammable. Please always consult the safety datasheet of the product.

Density control

For open flux application systems like e.g foam fluxing a flux density control can be useful. The density of the IF

2005M flux shall be checked using a suitable density meter, the value showed by the density meter should be com

pared, after temperature compensation, with the value in the IF 2005M density table and may only be adjusted

with the T 2005M accordingly.

Titration check

For open flux application systems like e.g foam fluxing, a titration check can be useful. The solids content value of

the IF 2005M flux can be determined by titration. The liquids for titration are available at Interflux. Adjustments of

the solid content may only be done by using T 2005M conditioner