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Cooling Thermal Conductive Silicone Gap Pad Filler for Laptop 1Cooling Thermal Conductive Silicone Gap Pad Filler for Laptop 2Cooling Thermal Conductive Silicone Gap Pad Filler for Laptop 3Cooling Thermal Conductive Silicone Gap Pad Filler for Laptop 4Cooling Thermal Conductive Silicone Gap Pad Filler for Laptop 5
  • Cooling Thermal Conductive Silicone Gap Pad Filler for Laptop 1
  • Cooling Thermal Conductive Silicone Gap Pad Filler for Laptop 2
  • Cooling Thermal Conductive Silicone Gap Pad Filler for Laptop 3
  • Cooling Thermal Conductive Silicone Gap Pad Filler for Laptop 4
  • Cooling Thermal Conductive Silicone Gap Pad Filler for Laptop 5

Cooling Thermal Conductive Silicone Gap Pad Filler for Laptop

Model:TIF120-15-12U
Brand:ZIITEK
Origin:Made In China
Category:Electronics & Electricity / Insulation Material
Label:thermal pad , silicone thermal pad , thermal gap filler
Price: US $1 / pc
Min. Order:10 pc
Inquire Now

Member Information

Detail

Product Description

Cooling Thermal Conductive Silicone Gap Pad Filler for Laptop

The TIF120-15-12U is an extremely soft gap filling material rated at a thermal conductivity of  1.5W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. TIF120-15-12U is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.

Features:

>  Good thermal conductive: 1.5 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  Available in varies thickness


Applications:

>  Cooling components to the chassis of frame  
>  High speed mass storage drives
>  Heat Sinking Housing at LED-lit BLU in LCD
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Telecommunication hardware
>  Handheld portable electronics
>  Semiconductor automated test equipment (ATE)

Typical Properties of TIF120-15-12U Series

Color

Sapphire Blue

Visual Composite Thickness  hermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber *** 10mils / 0.254 mm

0.55

20mils / 0.508 mm

0.82

Specific Gravity

2.10 g/cc

ASTM D297

30mils / 0.762 mm

1.01

40mils / 1.016 mm

1.11

Heat Capacity

1 l/g-K

ASTM C351

50mils / 1.270 mm

1.27

60mils / 1.524 mm

1.45

Hardness 27/35/45/60
(Shore 00)
ASTM 2240

70mils / 1.778 mm

1.61

80mils / 2.032 mm

1.77 

Tensile Strength 

40 psi

ASTM D412

90mils / 2.286 mm

1.91 

100mils / 2.540 mm

2.05

Continuos Use Temp

-40 to 160℃

***

110mils / 2.794 mm

2.16   

120mils / 3.048 mm

2.29   

Dielectric Breakdown Voltage >5500 VAC ASTM D149

130mils / 3.302mm

2.44

140mils / 3.556 mm

2.56

Dielectric Constant 5.5 MHz ASTM D150

150mils / 3.810 mm

2.67

160mils / 4.064 mm

2.77

Volume Resistivity 4.0X10"
Ohm-meter
ASTM D257

170mils / 4.318 mm

2.89

180mils / 4.572 mm

2.98

Fire rating 94 V0

equivalent UL

190mils / 4.826 mm

3.05 

200mils / 5.080 mm

3.14

Thermal conductivity 1.5 W/m-K ASTM D5470 Visua l/ ASTM D751 ASTM D5470

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Standard Thicknesses:           
0.010" (0.25mm)       0.020" (0.51mm)       0.030" (0.76mm)       0.040" (1.02mm)       0.050" (1.27mm)      

0.060" (1.52mm)       0.070" (1.78mm)       0.080" (2.03mm)       0.090" (2.29mm)       0.100" (2.54mm)      

0.110" (2.79mm)       0.120" (3.05mm)       0.130" (3.30mm)       0.140" (3.56mm)       0.150" (3.81mm)      

0.160" (4.06mm)       0.170" (4.32mm)       0.180" (4.57mm)       0.190" (4.83mm)       0.200" (5.08mm)
Consult the factory alternate thickness.


Standard Sheets Sizes:    

8" x 16"(203mm x 406mm)   16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied. 


Peressure Sensitive Adhesive:   

Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.


Reinforcement:   

TIF™ series sheets type can add with fiberglass reinforced.

 


Product Image

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Cooling Thermal Conductive Silicone Gap Pad Filler for Laptop 5
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Send Inquiry to this Member

Dongguan Ziitek Electronical Material and Technology Ltd

Building B8, Industry District Ⅱ, Xicheng,Hengli Township, Dongguan City

Phone:
18153-53781280
Fax:
中国
Contact:
Sophia (Sales)
Mobile:
18153781280

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