SMT chip mounter equipment accessories, Juki nozzles.
Product Description
The nozzles of JUKI chip mounters are important components of chip mounters and have various types and characteristics. The following is a detailed introduction about them:
Types
- By model: Common models include 500, 501, 502, 503, 504, 505, 506, 507, 508, 509, 510, 511, 512, 513, 514, etc. Different models of nozzles have different parameters such as size, inner diameter and outer diameter to adapt to different sizes and types of electronic components. For example, the nozzle of model 500 is suitable for smaller-sized components, while the nozzles of models 507 and 508 can be used for larger-sized components.
- By material:
- Diamond and ceramic materials: The tip parts of some nozzles are made of diamond and ceramic materials. These nozzles have high hardness and wear resistance, are durable and are not prone to whitening. They are suitable for picking up components that require high precision and stability in suction.
- Antistatic rubber and plastic materials: The tip parts of some nozzles are made of antistatic rubber and plastic materials. They have strong toughness and wear resistance and can effectively prevent electrostatic damage to electronic components. They are often used to pick up components that are sensitive to static electricity.
Functions
- Accurately pick up components: The nozzles of JUKI chip mounters can accurately pick up electronic components by generating vacuum adsorption force. The design and manufacturing precision of the nozzles ensure that they can stably pick up components of various shapes, sizes and weights, such as resistors, capacitors, chips, etc. during the operation of high-speed chip mounters.
- Accurately place components: After picking up components, the nozzles place the components accurately at the designated positions on the circuit board to complete the placement work. This requires the nozzles to work in coordination with other components of the chip mounter to ensure the placement precision and position accuracy of the components.
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