| Model: | - |
|---|---|
| Brand: | - |
| Origin: | Made In China |
| Category: | Industrial Supplies / Glass & Ceramics Machine |
| Label: | wafer glass , tgv glass , optical galss |
| Min. Order: | - |
| Last Online:07 Jul, 2025 |
High-Rigidity Glass Substrate for Through-Glass Via (TGV) Processes
We supply precision-engineered round optical glass substrates for board-level packaging using TGV (Through-Glass Via) technology. These thick glass wafers are optimized for high-density interconnects in advanced microelectronic and photonic packaging systems, offering excellent mechanical strength, thermal stability, and dimensional control. Available in standard and custom diameters, our substrates support direct via etching, metallization, and wafer-level assembly processes.
Key Features
Material Options: High-purity borosilicate glass, fused silica, or aluminosilicate glass
Thickness Range: 0.5 mm to 2.0 mm (customizable up to 5.0 mm)
Diameter: 2", 4", 6", 8", or custom round formats
Surface Quality: Optical-grade polish (10/5 to 60/40), rough ground available for pre-processing
Thermal Expansion: Matched to silicon or specific package requirements
TGV Processing Compatibility: Optimized for deep via drilling (laser or wet etch), metal filling, and planarization
Custom Processing Services
As a precision glass processor, Lighting offers complete customization to meet your application and integration needs:
CNC/CO₂/Ultrafast Laser TGV Drilling (hole diameter: ≥20 μm)
Double-Sided Polishing & Flatness Control (TTV < 10 μm optional)
Photolithography or Screen Printing Alignment Marks
Metal Coating: Ti/Cu, Au, ITO, or customer-specified seed layers
Edge Beveling, Cleaning, and Wafer-Level Packaging Support
Application Scenarios
These TGV-compatible glass substrates are ideal for:
5G & RF Packaging – Glass-based interposers for high-frequency signal transmission
Photonics Integration – Optical I/O, modulators, and silicon photonics alignment
MEMS Packaging – Hermetic glass covers or interposers with through-glass interconnects
Biomedical Devices – Glass carrier wafers and sensor packaging platforms
Power & Logic Devices – Advanced packaging substrates for improved thermal management and signal integrity
Contact us today for TGV substrate design support, prototype sampling, or high-volume production inquiries. Our engineering team ensures precision fabrication, rapid turnaround, and consistent quality control across all packaging glass solutions.
