Product Description
Number of Layers |
2layer |
4layer-10layer |
Copper Thickness |
0.5-10 oz |
0.5-10 oz |
Base Board Thickness |
0.2-4.0 mm |
0.4-5.2 mm |
Incombustibility |
94V - 0 |
94V - 0 |
Peelable resistance |
12.3N/cm |
12.3N/cm |
Twist |
≤0.5% |
≤0.5% |
Insulation resistance |
≥10(11)Ω |
≥10(11)Ω |
Test voltage |
100DCV |
100-200DCV |
Finished board area |
560*610mm |
560*610mm |
Min. Line Width and Spacing |
0.1/0.1mm |
0.1/0.1mm |
Copper thickness in hole |
≥25.0um |
≥25.0um |
Mini. pad diameter |
Inner layer |
|
0.5mm |
Out layer |
0.076mm |
0.076mm |
Mini. Hole Diameter |
0.25mm |
0.20mm |
Hole tolerance |
PTH |
±0.076mm |
±0.076mm |
NPTH |
±0.05mm |
±0.05mm |
Hole location tolerance |
±0.076mm |
±0.05mm |
profile tolerance |
CNC Routing |
±0.01mm |
±0.01mm |
Punching |
±0.013mm |
±0.013mm |
Solder mask bridge ability |
≥0.1mm |
≥0.1mm |
Solder mask rigidity |
6H |
6H |
Solderable test |
245℃ 5second |
245℃ 5second |
Thermal cycling ability |
288℃ 10second |
288℃ 10second |
Surface Finishing |
OSP,HAL,Immersion AU,Soft Au Plating,Gold Finger |
OSP,HAL,Immersion AU,Soft Au Plating,Gold Finger |
Qaulity standard |
IPC-A-600F,IPC-ML-950 |
IPC-A-600F,IPC-ML-950 |
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