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TIG830SP is a silicone compound that provides high thermal conductivity and low thermal resistance. The superior workability of TIG830SP makes it a good candidate for screen-printing and dispensing processes. Its thermal and dielectric performance under a wide range of operating temperatures make TIG830SP a good candidate to help solve heat problems arising from the higher frequency, miniaturization, and power generation trends in the development of electric and electronic devices.
KEY FEATURES
♦ High thermal conductivity
♦ Low Thermal Resistance
♦ Thin Bond Lines
♦ Highly workable – excels in screen-printing and automated dispensing
♦ Wide operating temperature range (-40°C ~ 150 °C)
♦ Low oil bleed, minimal weight loss at elevated temperatures
♦ Minimal ionic impurities
APPLICATIONS
♦ Thermal Interface Material between heat spreaders and heat sinks, heat pipes (TIM2)