solar scribing-cell machine
Product Description
Laser Wavelength：1064nm
Laser mode： semi-conductor
The maximum output power of laser：≥50Ｗ
Laser modulation frequency：200Hz~50KHz（Adjustable）
The size of work：320mm*320mm
Repeatability：0.002mm
Positioning accuracy：0.002mm
Marking line depth：0.01-0.3mm(Visual material)
Using power：220V/50Hz/2KW
Cooling：Water / compressor cooling
Application fields:
1, Dicing mono-crystalline and poly-crystalline silicon at solar industry, of non-crystalline silicon with solar cell chip and wafer. 2, Engraving and lineation of crystal less silicon cell board at solar energy industry. 3, Cutting and lineation of silicon, germanium, gallium arsenide semiconductor substrate materials at electronic industry.
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