CCL used ultafine silica powder filler
Product Description
Ultrafine quartz silica powder have good heat resistance, mechanical properties, electrical properties and has advantages of the dispersion resin system . superfine silica powder was applied in CCL copper clad laminate,is mainly valued silicon powder with high melting point (typically above 1700 ℃), small average size of 0.5-2um (some varieties are at the smallest 0.25μm), low dielectric constant (less than aluminum hydroxide, talc, E glass fiber) and low water absorption. Silica powder filler and other major inorganic filler in the physical properties, excellent dielectric properties.
Silica (sio2) has excellent physical properties,
such as : High insulation, high thermal conductivity, high thermal stability,
resistance : acid and alkali resistance, wear resistance,
low : low thermal expansion coefficient, low dielectric constant, as well as its low price advantage, development and utilization of a certain value.
With the silica surface treatment conditions improved self improve its compatibility with the resin system, so silica as a filler applied to theCCL( copper clad laminate), not only reduce costs but also improve some of CCL performance (such as thermal expansion coefficient, bending strength, dimensional stability, etc.), silica clad in use in more performance advantages,
| Payment Terms: | TT / LC / DP / DA |
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