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specifications and technical parameters

Main Features

1. Adopt liner slide which makes X、Y、Z axis all can do precision adjustment or fast positioning, with high positioning accuracy and fast operation;

2. high-precision temperature controller, built-in PC serial port, external sensor, can be connected with computer and proprietary software attached to it;

3. There are 3 independent heating areas from top to bottom. The 1st and 2nd are hot-air heaters, the 3rd is IR preheating, temperature controlled within ±3 °; Top heater can be adjusted freely, second heater can be adjusted up and down, top and bottom temperature can control many groups and sections of temperature parameters at the same time; the third IR area can be adjusted the power consumption;

4. Offer all kinds of hot-air nozzle, it can rotate 360°; With magnet, easy to install and change, customized is available;

5. Choose imported high-precision K-type thermocouple, closed loop control and automatic temperature compensation system.

6. Use a V-groove equipped with a flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled, and it can rework for any BGA package size;

7. powerful cross-flow fan rapidly cool the PCB board to improve efficiency; Also built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly;

8. After finishing desoldering & soldering, there is an alarming and alarming in advance;

9. CE certificate, with emergency stop and Automatic power-off protection device when abnormal accident happens; with a double over-heating protection control;

10. HD camera system, accurate judgments on the melting process during the BGA soldering and desoldering, provide critical vision.