3014(晶元)芯片灯珠

3014(晶元)芯片灯珠
型号:3014
品牌:晶元
原产地:台湾 中国
类别:电子、电力 / 其它电力、电子
标签︰3014贴片灯珠
单价: ¥100 / K
最少订量:2 K

产品描述

产品介绍:

产品尺寸图:

 

PART NO. (型号)

CHIP

Lens Color

Material

Source Color

3014白光

ALInGaP

White(白色)

yellow(黄色)

 

Notes:

1.        All dimensions 1.所有单位是毫米(英寸)

2.允许误差为正负0.25mm,除非另行通知。

3.规格可能随时有变化,不另行通知。

4.本数据有效期为六个月

Absolute Maximum Ratings at TA=25℃

 

Parameter(参数)

Valce(标准值)

Unit(单位)

Power Dissipation(消耗功率)

120

mW

Pilsed  Forward Current(脉冲顺向电流)

(1/10 Duty Cycle, 0.1ms Pulse width

100

mA

Continuous Forward Current(连续工作电流)

30

mA

Derating Linear From 50℃(电流比例关系)

0.4

mA /℃

Reverse Voltage(反向电压)

5

V

Operation Temperature Range(工作温度)

-40℃ to +80℃

Storage Temperature Range(储存温度)

-40℃ to +80℃

Lead Soldering Temperature

[4mm (.157”) From Body](焊接温度)

260℃ for 5 Seconds(260度下不超过5秒)

 

 

Electrical / Optical Characteristics at TA=25℃

 

Parameter(参数)

Symbol标志

Min. 最小值

Typ. 中间值

Max. 最大值

Unit单位

Test Condition测试条件

Luminous Intensity(光通量)

  Φ

10

11.5

14

Lm

IF=30mA Note 1.4

Source color(发光颜色)

CCT

6000

 

6500

K

IF=30mA Note4

Viewing Angle(发光角度)

2θ1/2

115

120

125

deg

Note 2

Forward Voltage(正向电压)

VF

3.0

3.2

3.4

V

IF=30mA

Reverse Current(反向电流)

IR

-

-

5

μA

VR=5V

 

Note1.Luminous intensity is measured with a light sensor and filter combination that approximates the CIE (Commission International De L’Eclairage) eye-response curve.

      2.1/2 is the off-axis angle at which the luminous intensity is half the axial luminous and intensity.

     3.The dominant wavelength, λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.

       4.The IV guarantee should be added ±15%.

 

 

                                       特性曲线图

 

Forward Current                                 Relative Luminous Intensity

IF = f (VF); TA = 25 °C                                     IV/IV(30mA) = f (IF); TA = 25 °C

Reflow Soldering Instructions (回流焊说明)

1.Number of reflow process shall be less than 2 times and cooling

process to normal temperature is required between first and Second soldering process.

(本产品最多只可回焊两次,且在首次回焊后须冷却至室温之后方可进行第二次回焊.)

2.When soldering, do not put stress on the LEDS during heating.(高温焊接时,不能外加压力在LED上.)

3.After soldering,do not warp the circuit board.(焊接完成后,不能弯曲线路板.)

1>Lead Solder(有铅回焊)

Recommended Soldering Patter (n推荐焊盘式样)

(单位:毫米)

3014(晶元)芯片灯珠 1

会员信息

深圳市宇亮光电技术有限公司
国家/地区︰广东省深圳市
经营性质︰生产商
联系电话︰13699813679
联系人︰邱敏 (业务经理)
最后上线︰2013/11/06