G6K 表面安装继电器

实现世界最小级别的封装面积与高度5.2mm低高度的表面安装继电器

? 高5.2mm×宽6.5mm×长10mm的超s小型，对应高密度封装

? 实现高度为5.2mm的低高度，封装效率提高的承诺

? 约0.7g的超轻量型，对应更高速度的封装

? 实现与本公司以往产品相比70%的低电力消耗100mW的高灵敏度

? 红外线照射效率极高的独特的端子构造，IRS封装时端子温度容易上升， 焊接性能良好（表面安装端子型）

? 实现线圈接点间耐高压AC 1,500V、且耐冲击电压1.5kV 10×160 μs（Fcc Part68标准）

? 将线圈 接点端子间距离的最佳化，还备有耐冲击电压达到2.5kV 2×10 μs（TelcoRdia规格对应）的Y系列产品

? 标准型取得UL、CSA规格

G6K-2F DC12
G6K-2F DC24
G6K-2F DC3
G6K-2F D.5
G6K-2F DC5
G6K-2F-RF DC12
G6K-2F-RF D.5
G6K-2F-RF DC5
G6K-2F-TR DC12
G6K-2F-TR DC3
G6K-2F-TR D.5
G6K-2F-TR DC5
G6K-2F-Y DC12 BY OMR/C
G6K-2F-Y DC24 BY OMR/C
G6K-2F-Y DC3 BY OMR/C
G6K-2F-Y D.5 BY OMR/C
G6K-2F-Y DC5 BY OMR/C
G6K-2F-Y DC9 BY OMR/C
G6K-2F-Y-TR DC12 BY OMR/C
G6K-2F-Y-TR DC24 BY OMR/C
G6K-2F-Y-TR DC3 BY OMR/C
G6K-2F-Y-TR D.5 BY OMR/C
G6K-2F-Y-TR DC5 BY OMR/C
G6K-2F-Y-TR DC9 BY OMR/C
G6K-2G DC12
G6K-2G DC5
G6K-2G-TR DC5
G6K-2P DC12
G6K-2P DC24
G6K-2P DC3
G6K-2P DC5
G6K-2P-Y DC12 BY OMR/C
G6K-2P-Y DC3 BY OMR/C
G6K-2P-Y D.5 BY OMR/C
G6K-2P-Y DC5 BY OMR/C
G6KU-2F-RF DC5
G6KU-2F-Y DC3 BY OMR/C
G6KU-2F-Y D.5 BY OMR/C
G6KU-2F-Y DC5 BY OMR/C
G6KU-2F-Y-TR DC3 BY OMR/C
G6KU-2F-Y-TR D.5 BY OMR/C
G6KU-2F-Y-TR DC5 BY OMR/C
G6KU-2P-Y DC12 OMR/C
G6KU-2P-Y DC3 OMR/C
G6KU-2P-Y D.5 OMR/C
G6KU-2P-Y DC5 OMR/C