~1.New Product Design & Development (Electronic & Mechanical)
 
2.Prototyping and Pre-production
 
3.Surface Mount Technology (SMT) & Ball Grid Array (BGA) with repair capability
 
4.Through Hole Assembly
 
5.Coating and Potting
 
6.Casing Assembly / Complete Unit Assembly
 
7.In-circuit Testing, Functional Testing, and System Testing
 
8.Packaging and Distribution
 
  9.Programming of Micro Controllers, Memory Devices, and Programmable Logic