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JT SPI-REFINE系列技术参数/JT SPI-REFINE Series Specifications |
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设备型号/Model: |
REFINE-M |
RRFINE-L |
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检测模块/Inspection Module: |
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相机配置/Camera Specification |
4百万像素工业相机，超高帧数(出厂时设定) 4M High-frequency Industrial Camera, High Frame Number (Factory Setting) |
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像素大小/Pixel |
20um, 15um(Factory Setting) |
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FOV（单个视野）范围 |
40x40mm, 30x30mm(Factory Setting) |
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灯源/LED |
RGB+TOP |
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高度检测范围/Height Range |
0 - 550 um |
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高度检测分辨率/Height Resolution |
0.36 um |
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高度检测精度/Height Accuracy |
1um（基于实际锡膏/校正块 Based on the actual solder paste/calibration block） |
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检查项目/Inspection Item |
体积、面积、高度、XY位置、形状等 /Volume, Area, Height, X/Y Position, Bridging, Shape, etc |
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不良种类/Defection Types |
多/少锡、漏印、锡膏拉尖，桥连、偏移、异行、沾污等/Excessive/Insufficient/missing paste, Bridge 2D&3D,Paste displacement, Shape deformity, Dust, etc |
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体积、高度、面积测量重复性/ Repeatability (Volume, Area, Height) |
＜1%@3sigma |
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GR&R (Gauge Reproducebility and Repeatability) |
＜10%（@6sigma tolerance = +/-50%） |
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测试速度/Inspection Speed |
0.3S/FOV |
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轨道与PCB尺寸/Conveyor & PCB Size: |
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最大板尺寸/Max PCB Size |
330×250 mm |
510×510 mm |
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最小板尺寸/Min PCB Size |
50×50 mm |
50×50 mm |
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PCB上方净高/PCB Up-Clearance |
30 mm |
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PCB下方净空/PCB Bottom-Clearance |
30 mm |
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可适应PCB厚度/PCB Thickness |
0.3 - 5mm |
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PCB最大弯曲/Max PCB Warpage |
±3mm |
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元件至板边最小距离/PCB Transfer Height |
2.5mm |
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轨道高度范围/PCB Transfer Height |
900±20mm |
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最大板重量/Max PCB Weight |
5kg |
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框架与其他/Frame & Others: |
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底座与框架/Base & Frame |
整体铸铁底座框架，整体成型，坚固稳定/Integral Steel casting frame, firmly, ensure the high accuracy of Inspection |
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设备长宽高与重量/System Dimensions and Weight |
885×1090×1600 mm (W×D×H), 950 kg |
1060*1310*1600 mm (W×D×H), 1200 kg |
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电源/Power Supply |
220V单相/Single phase, 50/60 HZ,3 kwh |
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通讯界面/Communication Interface |
SMEMA |
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气源/Air Supply |
4-6 bar, 5 L/min |
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操作温度与湿度/Operating Condition |
5-40 ℃，15-90%RH |
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选配件/Options： |
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1、BarCode识别器/Barcode Reader |
4、维修站(含计算机)/Repair Station(PC) |
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2、3D校正块/3D Calibration Target |
5、人机交换系统(电容触摸LCD显示器+声控)/ Infared Muti-touch LCD+Voice control |
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3、2D校正玻璃/2D Calibration Glass |
6、离线编辑软件(含加密锁)/Offline editing software(License key) |
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