Base Material Megtron 6, used for 25Gbps Line card Project, high frequency PCB, Immersion Gold, blind/buried via holes, Back drill, Rotated 7 degree
- Layer count: 18L
- materials: M6
- Board thickness: 3.0+/-0.3mm
- Finishing Size: 210x395.2mm
- Min Line w/s: 3.2/3.5mil
- Min drill size [FHS/DHS] : 0.20mm/0.30mm
- Plating AR DHS : 11.7:1
- Hard gold thickness: 4UM
- Surface finish: ENIG
- Impedance: Tol: +/-7%, the deviation of the impedance in the same layer must not exceed +/- 2Ohm
- Other : Back drill, Rotated 7 degree.
