在線式選擇性波峰焊 型號 SUNFLOW3

機體參數

General technical data

最大PCB 板尺寸/Max PCB size (mm) 510(L)x450(W)

最小PCB 板尺寸/Min PCB size (mm) 120(L)x50(W)

PCB 頂部間隙/PCB top side clearance (mm) 120

PCB 底部間隙/PCB bottom side clearance (mm) 30

PCB 工藝邊/PCB technics side (mm) ≥3

傳送帶距離地面高度/Conveyor height from floor (mm) 850±25

PCB 傳送速度/PCB conveyor speed (m/min) 0-12

PCB 重量/Max PCB weight (kg) ≤5

PCB 厚度(包含治具)/PCB thickness (including fixture) (mm) 1-6

傳送帶可調範圍/Conveyor width adjustment (mm) 50-450

傳送帶調寬方式/Conveyor width adjustment mode 電動/Electromotion

傳送帶可調寬精度/Conveyor width adjusted accuracy (mm) ±0.1

PCB 傳送方向/PCB Conveyor direction 左向右/Left to right

壓縮空氣所需壓力/Compressed air required pressure (Mpa) 0.5-0.8

電源電壓/Main voltage(VAC) 380

電壓容差/Voltage tolerance range (%) 6-10

頻率/Frequency (HZ) 50/60

最大功耗/Max power consumption (kw) <25

最大電流/Max amperage (A) <34

環境溫度/Ambient temperature (℃) 10-35

機器噪音/Permanent sound level (dB) <65

通訊接口/Communication interface SMEMA

設備外形尺寸/Overall dimensions(mm) 3010(L)*1620(W)*1700(H)

設備重量/Equipment weight(kg) 2000

焊接系統

Soldering module

焊接噴嘴/Solder nozzle 高精度單噴嘴/High precision single nozzle

最小噴嘴外徑/Smallest nozzle outer diameter (mm) 5.5

噴嘴內徑/Nozzle inner diameter (mm) 2.5-10

最大波峰高度/Max solder wave height (mm) 5

錫爐容量/Solder volume (kg) 5

最大焊接溫度/Max solder temperature (℃) 350±2

錫爐加熱功率/Soldering heating power (kw) 1.3

氮氣供應/Nitrogen supply 由客戶提供/Offered by customer

氮氣所需壓力/Nitrogen required pressure (Mpa) 0.3

氮氣消耗量/Nitrogen consumption (m³/h) 1.2

所需氮氣純度/Required particle cleanliness (%) ﹥99.99

預熱系統

Preheating module

預熱溫度範圍/Preheat temperature range (℃) 0-200

預熱控溫精度/Preheat control accuracy (℃) ±2

加熱功率/Preheating medium (kw) 21

PCB 溫度均勻性/PCB temperature uniformity (℃) 5

加熱方式/Preheating medium 熱風+紅外/Hot air+Infrared

頂部預熱/Top side preheating 熱風/Hot air

噴霧系統

Flux module

噴霧高度/Spray height(mm) 60

噴霧速度/Control speed(mm/s) ≤400

噴嘴自動清洗功能/Spray head automatically cleaning 程序控制/Program control

助焊劑流量/Flux consumption(ml/min) 2-60

助焊劑箱體容量/Flux content(L) 2